Sep 2020 – Dec 2023: Beijing University of Chemical Technology, College of Information Science and Technology, Doctor of Philosophy (Ph.D.)

Sep 2017 – Jun 2020: Beijing University of Chemical Technology, College of Information Science and Technology, Master of Engineering

Sep 2013 – Jun 2017: Beijing University of Chemical Technology, College of Information Science and Technology, Bachelor of Engineering

Nov 2025 – Present: Tsinghua University, Beijing National Research Center for Information Science and Technology (BNRist), Faculty Member

Dec 2023 – Nov 2025: Tsinghua University, School of Integrated Circuits, Postdoctoral Fellow

（1）Intelligent Chips and Systems

（2）Advanced Silicon-based Ferroelectric Memory Logic and In-Memory Computing Chips

（3）Ultra-Low Power Analog-to-Digital Converters for In-Memory Computing Chips

He has long been engaged in research on high-performance, low-power intelligent chips and systems. His main research directions include: large-scale hafnium-based ferroelectric memory chips (Mbit-level), novel in-memory computing chip design, special-process integrated circuits, and high-temperature resistant analog-to-digital converters (ADCs). He has led his team to successfully tape out chips twelve times and designed the first domestic high-temperature (175°C), high-precision, aerospace-grade SAR ADC chip. In the past five years, he has published over 10 high-level SCI papers and conference proceedings as the first author, co-first author, or corresponding author in top-tier journals and conferences, including the integrated circuit design field's leading journal IEEE TCAS, the sensor field's leading journal ACS Nano, and the premier international semiconductor device conference IEDM. He has applied for 12 invention patents.

Shuimu Tsinghua Scholar, Tsinghua University (2024)

(1) Intelligent Chips and Systems

(2) Advanced Silicon-based Ferroelectric Memory Logic and In-Memory Computing Chips

(3) Ultra-Low Power Analog-to-Digital Converters for In-Memory Computing Chips

Representative Achievements：

[1] Huang, Dapeng*; Liu, Hang*; Liu, Houfang; Zhu, Yeqing; Xu, Wenjia; Liu, Haitao; Zhu, Ming zhao; Liu, Zhoutong; Yang, Yuzhe; Guo, Yida; Wang, Tao; Shao, Tianqi; Li, Yu-Tao; Yang, Yi; Ren, Tian-Ling; Facet-Engineered Atomic Interface and On-Chip Continuous-Amplitude Modulated Recovery Enabling Ultra-High Endurance for Hafnium-Based Ferroelectric Memories, Acs Nano, 2025, 19(30): 27192-27203.

[2] Y. Zhang*; Y. -B. Dai*; H. Qin*; Hang. Liu*; Z. Zhou; S. Xia; H. Lai; H. Xiang; C. Shen; B. Su; D. Huang; B. Wu; Y. Zhu; Y. Liu; S. Gu; X. Zhang; H. Zhang; X. Wang; Y. -T. Li; Y. Tong; K. -H. Xue; X. Miao; Y. Yang; T. -L. Ren; First-Principles-Augmented KAI Model Bridging Nucleation to Domain-Wall in Ferroelectric AlScN, 2025 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2025-11-06至2025-11-10.

[3] Liu, Hang; Li, Yuying; Shen, Haoyuan; Wu, Bo; Jin, Yu; Yu, Duli; Sun, Heming; An UltraHigh Linear Digitization Temperature Sensor Based on SAR ADC With Common-Mode Temperature Drift Suppression, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2024, 71(3).

[4] Shen, Hao-Yuan*; Li, Yu-Tao*; Liu, Hang*; Lin, Jie; Zhao, Lu-Yu; Li, Guo-Peng; Wu, Yi-Wen;

Ren, Tian-Ling; Wang, Yeliang; Machine Learning-Assisted Gesture Sensor Made with Graphene/Carbon Nanotubes for Sign Language Recognition, ACS APPLIED MATERIALS amp; INTERFACES, 2024, 16(39)).

[5] Liu, Hang*; Sun, Kuan*; Guo, Xiao-Liang; Liu, Zi-Lin; Wang, Yu-Hao; Yang, Yi; Yu, Duli; Li, Yu-Tao; Ren, Tian-Ling; An Ultrahigh Linear Sensitive Temperature Sensor Based on PANI:Graphene and PDMS Hybrid with Negative Temperature Compensation, ACS NANO, 2022, 16(12).