长期从事高性能、低功耗智能芯片与系统研究，主要研究方向包括：大规模铪基铁电存储器芯片（Mbit级）、新型存算芯片设计、特殊工艺集成电路及耐高温模数转换器。带领团队实现芯片成功流片十二次，设计了国内首个耐高温（175℃）、高精度航天级SAR ADC芯片。近五年，以一作/共一/通讯作者在集成电路设计领域顶级期刊IEEE TCAS、传感器领域顶级期刊ACS Nano以及国际半导体器件顶级会议IEDM等发表高水平SCI论文及会议10余篇。申请发明专利12项。
代表性成果：
[1] Huang, Dapeng*; Liu, Hang*; Liu, Houfang; Zhu, Yeqing; Xu, Wenjia; Liu, Haitao; Zhu, Ming zhao; Liu, Zhoutong; Yang, Yuzhe; Guo, Yida; Wang, Tao; Shao, Tianqi; Li, Yu-Tao; Yang, Yi; Ren, Tian-Ling; Facet-Engineered Atomic Interface and On-Chip Continuous-Amplitude Modulated Recovery Enabling Ultra-High Endurance for Hafnium-Based Ferroelectric Memories, Acs Nano, 2025, 19(30): 27192-27203.
[2] Y. Zhang*; Y. -B. Dai*; H. Qin*; Hang. Liu*; Z. Zhou; S. Xia; H. Lai; H. Xiang; C. Shen; B. Su; D. Huang; B. Wu; Y. Zhu; Y. Liu; S. Gu; X. Zhang; H. Zhang; X. Wang; Y. -T. Li; Y. Tong; K. -H. Xue; X. Miao; Y. Yang; T. -L. Ren; First-Principles-Augmented KAI Model Bridging Nucleation to Domain-Wall in Ferroelectric AlScN, 2025 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2025-11-06至2025-11-10.
[3] Liu, Hang; Li, Yuying; Shen, Haoyuan; Wu, Bo; Jin, Yu; Yu, Duli; Sun, Heming; An UltraHigh Linear Digitization Temperature Sensor Based on SAR ADC With Common-Mode Temperature Drift Suppression, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2024, 71(3).
[4] Shen, Hao-Yuan*; Li, Yu-Tao*; Liu, Hang*; Lin, Jie; Zhao, Lu-Yu; Li, Guo-Peng; Wu, Yi-Wen;
Ren, Tian-Ling; Wang, Yeliang; Machine Learning-Assisted Gesture Sensor Made with Graphene/Carbon Nanotubes for Sign Language Recognition, ACS APPLIED MATERIALS amp; INTERFACES, 2024, 16(39)).
[5] Liu, Hang*; Sun, Kuan*; Guo, Xiao-Liang; Liu, Zi-Lin; Wang, Yu-Hao; Yang, Yi; Yu, Duli; Li, Yu-Tao; Ren, Tian-Ling; An Ultrahigh Linear Sensitive Temperature Sensor Based on PANI:Graphene and PDMS Hybrid with Negative Temperature Compensation, ACS NANO, 2022, 16(12).
